Welcome
We have a pleasure to invite to the conference
"MICROTECHNOLOGY AND THERMAL PROBLEMS IN ELECTRONICS"
28th of June - 1st of July 2011 Lodz, Poland
The International Conference MicroTherm - "Microtechnology and Thermal Problems in Electronics" has been organised periodically since 1996. The success of the first seminar and successive conferences led us to the eighth edition. The Conference main goal was and is to give the possibility to present the achievements of experienced and young researchers as well as students that form their first steps in the world of science.
The main topics of the Conference are:
| A | optimizing designs of semiconductor devices, integrated and hybrid circuits, and electronic equipment, |
| B | reliability and thermal management of electronic elements, devices and systems, |
| C | investigation and measurements of semiconductor devices, materials and electronic systems, |
| D | extreme temperature electronics (materials, devices and circuits), |
| E | processes of microelectronics technology and packaging of electronics elements, |
| F | wide-band gap materials (special session devoted to SiC is considered), |
| G | renewable energy solutions (especially dedicated for photovoltaic and power harvesting), |
| H | photonic and optoelectronic devices and systems, |
| I | integrated microsystems |
The Conference is organised by:
DEPARTMENT OF SEMICONDUCTOR AND OPTOELECTRONICS DEVICES
TECHNICAL UNIVERSITY OF LODZ, POLAND
with the cooperation of:
INSTITUTE OF MICROELECTRONICS AND OPTOELECTRONICS
WARSAW UNIVERSITY OF TECHNOLOGY, POLAND
under the auspices of:
- Minister of Science and Higher Education
- Rector of Technical University of Lodz
- Governor of the Lodz Voivodship
- The Mayor of the Lodz City
- IEEE Poland Section
- Polish Academy of Science
- Association of Polish Electrical Engineers SEP
Important messages:
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We have a pleasure to inform you that we have signed the agreement with Elsevier Publisher and all the papers presented at the Conference, after additional review, will be published in Special Issue of the Journal Materials Science and Engineering - B.
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